Printed Circuit Board Bending Test Jig

Evaluation of Bending Strength of Electronic Components and Printed Circuit Boards

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Substrate Guide Bending Test Jig

評估電子元件和基板的彎曲強度。

特色

  • 可進行受質的 3 點和 4 點試驗。

    • 可測量阻抗值，同時測量受質強度。(選配)
    • 可計算臨界彎曲和其他試驗參數。
    • 可執行循環彎曲試驗。
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